Japan Society for Design Engineering

Journal "Design Engineering" Vol.35,No.9 2000
CONTENTS

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Special Issue: Thermal Design for Electronic Devices

Explanation

Three-Dimensional Analysis of Thermal Flow for Cooling of Electric Equipment

Katsuhisa NOTO

1

Cooling Technology of Microprocessor using Heat Pipes

Jun NIEKAWA

6

Optimum Design of Heat Sink for Impingement Air-Cooling of LSI Packages

Yoshihiro KONDO

12

Thermal Design of a Slim Notebook PC

Takashi KOBAYASHI

17

Series: Design Transition(10)

Design Transition of Bicycle and Development of Latest Small and Light Folding Bicycle

Takao ONO, Kiyoshi TAKEHARA and Mitsuo SUZURI

23

Series: Recent Educational State of Design, Drawing and Making Things
(From North and South) (5)

Education of Mechanical Design Drawing and Manufacturing Practice in Oyama National College of Technology

Sumiyoshi MITA, Yoshihiro INOSE and Masaru OHYABU

29

Series: Map of Members (1)

Present State and Personnel Map of JSDE Kyushu Branch

Kazunori ICHIMARU and Naoshi IZUMI

35

Paper

A Simplified Estimation of Natural Frequencies of Rib-stiffened Structures for the Design of Gear Case for Low Vibration

Kunihiko MORIKAWA, Masana KATO and Katsumi INOUE

38

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